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     No-Residue™ Soldering Flux

IF2005Mz

Datasheet IF2005Mz No-Residue Flux

Appearance

Solids

Spec. Gravity

Conditioner

  Clear/Colorless

1.8%

.810

T2005M

IF2005Mz is known as the benchmark in No-clean/Residue-Free soldering. This Halide Free No-Residue flux is the chemistry of choice by the leading electronics assembling companies, due to its high performance, track history and substantial savings associated with implementing this technology. With this flux and the correct machine parameters you can totally eliminate cleaning without compromising on cosmetics and soldering results. When quality counts you can count on IF2005Mz No-Residue Flux.

IF2005Mz is the only No-Clean/Residue Free chemistry ever passed MIL-F-14256F Qualifications and MIL-STD-2000A Compliance without cleaning.

(Compliance reports MIL, Bellcore and IPC are available upon request.)

"True reliability does not allow assumptions based on today’s tests trying to predict the future,  it is better based on sound traceable performance history."

     Patrick O. Bruneel

Interflux Technical Info  More information on No-Residue                                          IF2005Mz Datasheet PDF Format  Spec. Sheet    RoHS
     No-Clean Cored Solder

          IF14

Data Sheet IF14 No-Clean Cored Solder

IF14 No-Clean cored solder is formulated to provide Fast  wetting with minimal amount of flux residue. Residues can be brushed off with a dry brush "no solvents or cleaning liquids required". Its flux core is based on the highly  successful IF2005Mz No-Residue liquid flux technology.

IF14 is available in all standard alloys (Sn63/37-Sn96/4) and diameters (.015,.020,.030,.040,.062). Complies to MIL-STD-2000A and Bellcore, test reports available on request.  

Work instructions IF14  Work instructions on how to use the IF14                       IF14 No-Clean Cored Solders Datasheet PDF Format  Spec. Sheet Sn63

                                                                                                       Spec. Sheet Sn96   RoHS
     No-Residue™ Solder Paste

      IF-SP316

Data Sheet IF-SP316 No-Residue Solder Paste

 

IF-SP316 No-Residue™ Solder paste is designed to eliminate cleaning without compromising on board cosmetics. The paste has the same chemical and physical characteristics as the IF2005Mz No-Residue flux and the IF14 No-Clean Cored solder.

The chemistry becomes totally volatile in the dwell time above reflow. The solderability of the paste is excellent even on OSP copper boards. 

Solder Paste Profile Reflow profile                                                                                      IF316 No-Residue Solder Paste Datasheet PDF Format Spec. Sheet

     Low Dross Bar Solder

Six Sigma

Data Sheet Interflux Six Sigma Solder

Sn     -   65
As < .0001
Sb < .0001
Au < .0003

Fe < .0005
Ni < .0005
Bi < .0008
Al < .0003

Cu < .0005
Ag < .0003
Zn < .0005
Cd < .0005

In < .0007
S         --
P         --
Pb   Balance

Six Sigma ® is the purest solder available in the industry. This electrolytic refined alloy enhances the physics in your wave soldering operation and eliminates excessive dross experienced with conventional solders. Spec. Sheet  

When Quality counts you can count on Interflux USA

ISO 9001 Accreditations Interflux USA, Inc.

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Last updated: February 11, 2008.

 

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